Surface Mount Device Package Types

Micro surface mount device extended technology.

Surface mount device package types.

As electronic devices become more complex and available space is reduced the desirability of a surface mount package increases. Ceramic flat pack clga. Chip array small scale ball grid array cbga. Surface mount device package types soic package.

A dip can either be a surface mount or through hole device and refers to the location of the leads on either side of the devices case. Sot 223 small outline transistor. Example chip on board is a packaging technique that directly connects a die to a pcb without an interposer or lead frame. A very large number of different types of package exist.

Concurrently as the device complexity increases the heat generated by operation. The sot223 package is used for higher power devices like higher power surface mount transistors or other surface mount devices. The small outline integrated circuit soic plastic package is shown above. There is a wide range of smd component packages available on the market and come in many shapes and sizes a selection can be seen below.

Bumpered quad flat pack cabga ssbga. Surface mount device package types. It is larger than the sot 23 and it measures 6 7 mm x 3 7 mm x 1 8 mm. Ceramic pin grid array cpga graphic cqfp.

Ceramic ball grid array cfp. Bump chip carrier bga.